This post was originally published on Data Center Knowledge
California-based fabless semiconductor firm AmberSemi said it has taped out a new power-delivery device for AI processors in data centers, claiming large power reductions in board-level power distribution losses. The coin-sized PowerTile mounts on the back of a server board directly beneath the processor, and, according to the company, can cut board-level power distribution losses by 85%.
The PowerTile is a 1,000-amp vertical power device that delivers current via a vertical path rather than a traditional lateral one. Measuring about 20mm x 24mm x 1.68mm – roughly the size of a quarter – the module can be used with multiple devices to scale beyond 10,000 amps. AmberSemi said it is designed to support CPUs, GPUs, FPGAs, and other high-performance processors that require large current delivery in a minimal space.
For a 500 MW AI data center, AmberSemi estimates the PowerTile can save 225 MW of power per year (worth $160 million). The company compares this to the approximate annual energy output of a small modular nuclear reactor, depending on plant capacity and capacity factor.
Mark Vena, CEO and principal analyst at SmartTech Research, said AmberSemi’s PowerTile addresses a real need in the data center.
“This is entirely on target,” Vena told Data Center Knowledge.
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